Beschreibung
Our customer is an international telecommunications company, involved in the R&D of cutting-edge mobile technologies. We currently have an exciting opportunity for a PCB Layout Designer
Project Start: as soon as possible
Project duration: 6-12 months
Location: Munich or Regensburg
Task Description:
- Routing/conceptual studies for substrate based semiconductor packaging based a given chip design or floor plan studies
- Layout of substrates for flip chip packages or rewiring of 1-layer wafer-level packages (fan-out) in chip/package co-design environment, in close coordination with Concept Engineering Concept in chip and package area
- layout of printed circuit boards for testing purposes (daisy chain routing)
Required Skills:
- Knowledge of Layout of Semiconductor Housing
- Cadence tool or Mentor Graphics tool knowhow
If you are interested in this vacancy, we would be pleased to receive your CV together with your availability and financial expectations.