PCB Layout Designer

Vertragsart:
Vor Ort
Start:
ASAP
Dauer:
6-12 months +
Von:
Harvey Nash Plc - Stuttgart
Ort:
Bayern
Eingestellt:
17.05.2012
Land:
flag_no Deutschland

Projektbeschreibung
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Our customer is an international telecommunications company, involved in the R&D of cutting-edge mobile technologies. We currently have an exciting opportunity for a PCB Layout Designer

Project Start: as soon as possible

Project duration: 6-12 months

Location: Munich or Regensburg

Task Description:

  • Routing/conceptual studies for substrate based semiconductor packaging based a given chip design or floor plan studies
  • Layout of substrates for flip chip packages or rewiring of 1-layer wafer-level packages (fan-out) in chip/package co-design environment, in close coordination with Concept Engineering Concept in chip and package area
  • layout of printed circuit boards for testing purposes (daisy chain routing)

Required Skills:

  • Knowledge of Layout of Semiconductor Housing
  • Cadence tool or Mentor Graphics tool knowhow

If you are interested in this vacancy, we would be pleased to receive your CV together with your availability and financial expectations.