Beschreibung
We are looking for a
RF Package Design Engineer (m/f)
Reference: -en
Start: asap
Duration: 6 MM
Place: in Munich
Branch: Herstellung von bestückten Leiterplatten
Your tasks:
- Developing optimised layout design for RF ICs using today's most advanced packaging technologies
- Maintaining design connectivity, chip floor plan and pinout as well as ball map updates
- Developing test vehicle designs to further optimise packaging technologies and methods
- Aligning PCB and chip floor plan requirements
Your qualifications
- Basic understanding of RF circuits and analogue circuits in general
- Knowledge of thermal/mechanical/electrical design constraints
- Understanding of signal and power integrity requirements
- Understanding the needs of board and chip layout requirements and how to co-design in a complex and multi-constraint design environment
- Excellent know-how of modern Packaging EDA software
- Knowledge of Cadence Virtuoso Layout Editor
- Good knowledge of UNIX, scripting languages (Tcl, Shell, Perl etc.) and data management
- Fluency in English, German language skills are beneficial
Skills:
- Hardware developer
Keywords: Hardwareentwickler