Beschreibung
For our customer in Greater Nuremberg Area, Germany we are currently searching for a Package Layouter (w/m)Project Start: 15.09.12
Project duration: 3 Months
Location: Greater Nuremberg Area and Home-Office
Know-How:
- Layout of package substrates and Redistribution layers in a Co-Design Environment, Considering interactive and simultaneous layout of chip, package and printed circuit board.
- Support system concept engineering with concept studies
- Finalise and optimise the package layout
- Act as interface to the codesign flow team and simulation (electrical, mechanical, thermal) engineers.
- Experience with Cadence (SIP) and/or Mentor Graphics
Language Knowledge:
- Written and spoken English know-how is demanded, all documentation will be in English
If you are interested in this vacancy , we would be pleased to receive your CV - /