Beschreibung
Thermo-mechanical Package and Material Evaluation Expert (m/f)
Reference: -en
Start: asap
Duration: 6 MM++
Main tasks:
- Set up the competency to evaluate advanced electronic package technologies concepts (such as millimeter wave packages, system in package SiP) by thermal and thermo-mechanical simulation and measurement
- Thermo-fluid simulation to optimize the heat dissipation in electronic packages
- Suggest competitive cooling concepts for electronic packages
- Close cooperation with package technology experts and system experts from internal and external (such as universities)
- Support definition of thermal resistance in the datasheet
Main qualifications
- Good education in Mechanical Engineering, Physics, Electronics, or equivalent
- Very deep experience in the semiconductor industry, mainly in thermal and thermo-mechanical simulation
- Profound experience in thermal and thermo-mechanical simulation of electronic packages
- Experience in the definition of cooling concepts for semiconductor packages
- Good English language skills
Main advantages:
- Working with a leading telecommunication solutions provider
About us:
Our many years of recruitment experience and specialist knowledge of the engineering job market make us a strong partner for engineers and technicians. We maintain intensive relationships with customers across all industries and so can provide engineering specialists with exciting projects and attractive job opportunities. Whether it's working with an international automotive manufacturer or a regional market leader in mechanical engineering, drawing on your interests and experience, we will find the right job to suit you. Because with us, specialists find their ideal working environment – all completely free of charge. Register with us and reap the benefits of job offers that are both interesting and relevant to your skills and experience.
My contact at Hays:
My contact person:
Henrik Gmelch
Referencenumber:
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